Impulse Printing™
A revolutionary new printing technology
Micron sized features
Impulse Printing™ starts with a custom filling system which fills grooves in a plate under high pressure. The plate is then rapidly heated, transferring the complete pattern in under a millisecond.
The plate is made using a lithographic process, enabling high resolution down micron sized features. Selective heating makes it possible to perform local alignment between the pattern and a substrate.
Using a flat heater plate and a stencil print process, larger features can be made in the same machine.
Complex 3D INterconnects
By printing a complete pattern all at once, never before seen applications are possible. In the video on the right, a wrap around connection is printed in real-time. Five lines are printed in an upwards direction. When part of the line hits the glass slide, the rest slingshots around two edges to create a front to back interconnection. In this demo, five heater zones are digitally controlled, with four lines arriving in an instant and one arriving later.
Bridging a 2mm gap.
Wrap around a 1mm thick glass slide.
15 and 20 micron width prints.
Printing on top of a 1mm high chip.
Solder paste at 1.3mm print gap and 300μm pitch.
Solder paste droplets on a 2x2mm LGA package.
Get in touch
A proto-tool is available at FononTech, compatible with a wide range of materials. A robot arm allows precise handling of any type of substrate and supports all research activities.
A beta tool with the capability to print down to 2μm feature size is available for delivery in Q2 2024. It features 256 individually controlled printing zones to enable multi-layer printing, local substrate alignment and redudancy.
Print Area: 128 x 128 mm²
Substrate vacuum chuck: 300 x 300 mm²
